moc3061_图文

GlobalOptoisolator

6-Pin DIP Zero-Cross Optoisolators Triac Driver Output
(600 Volts Peak)
The MOC3061, MOC3062 and MOC3063 devices consist of gallium arsenide infrared emitting diodes optically coupled to monolithic silicon detectors performing the functions of Zero Voltage Crossing bilateral triac drivers. They are designed for use with a triac in the interface of logic systems to equipment powered from 115/240 Vac lines, such as solid–state relays, industrial controls, motors, solenoids and consumer appliances, etc. Simplifies Logic Control of 115/240 Vac Power Zero Voltage Crossing dv/dt of 1500 V/s Typical, 600 V/s Guaranteed To order devices that are tested and marked per VDE 0884 requirements, the suffix "V" must be included at end of part number. VDE 0884 is a test option. Recommended for 115/240 Vac(rms) Applications: Solenoid/Valve Controls Lighting Controls Static Power Switches AC Motor Drives MAXIMUM RATINGS
Rating INFRARED EMITTING DIODE Reverse Voltage Forward Current — Continuous Total Power Dissipation @ TA = 25°C Negligible Power in Output Driver Derate above 25°C OUTPUT DRIVER Off–State Output Terminal Voltage Peak Repetitive Surge Current (PW = 100 s, 120 pps) Total Power Dissipation @ TA = 25°C Derate above 25°C TOTAL DEVICE Isolation Surge Voltage(1) (Peak ac Voltage, 60 Hz, 1 Second Duration) Total Power Dissipation @ TA = 25°C Derate above 25°C Junction Temperature Range Ambient Operating Temperature Range Storage Temperature Range Soldering Temperature (10 s) VISO PD TJ TA Tstg TL 7500 250 2.94 – 40 to +100 – 40 to +85 – 40 to +150 260 Vac(pk) mW mW/°C °C °C °C °C VDRM ITSM PD 600 1 150 1.76 Volts A mW mW/°C VR IF PD 6 60 120 1.41 Volts mA mW mW/°C Symbol Value Unit

MOC3061 MOC3062 MOC3063

6

1

STANDARD THRU HOLE



Temperature Controls E.M. Contactors AC Motor Starters Solid State Relays

COUPLER SCHEMATIC
1 2 3
ZERO CROSSING CIRCUIT

6 5 4

1. 2. 3. 4. 5.

ANODE CATHODE NC MAIN TERMINAL SUBSTRATE DO NOT CONNECT 6. MAIN TERMINAL

1. Isolation surge voltage, VISO, is an internal device dielectric breakdown rating. 1. For this test, Pins 1 and 2 are common, and Pins 4, 5 and 6 are common.

MOC3061, MOC3062, MOC3063

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic INPUT LED Reverse Leakage Current (VR = 6 V) Forward Voltage (IF = 30 mA) OUTPUT DETECTOR (IF = 0) Leakage with LED Off, Either Direction (Rated VDRM(1)) Critical Rate of Rise of Off–State Voltage(3) COUPLED LED Trigger Current, Current Required to Latch Output (Main Terminal Voltage = 3 V(2)) MOC3061 MOC3062 MOC3063 Peak On–State Voltage, Either Direction (ITM = 100 mA, IF = Rated IFT) Holding Current, Either Direction Inhibit Voltage (MT1–MT2 Voltage above which device will not trigger.) (IF = Rated IFT) Leakage in Inhibited State (IF = Rated IFT, Rated VDRM, Off State) Isolation Voltage (f = 60 Hz, t = 1 sec) 1. 2. 2. 3. IFT — — — VTM IH VINH IDRM2 VISO — — — — 7500 — — — 1.8 250 5 — — 15 10 5 3 — 20 500 — Volts A Volts A Vac(pk) mA IDRM1 dv/dt — 600 60 1500 500 — nA V/s IR VF — — 0.05 1.3 100 1.5 A Volts Symbol Min Typ Max Unit

Test voltage must be applied within dv/dt rating. All devices are guaranteed to trigger at an IF value less than or equal to max IFT. Therefore, recommended operating IF lies between max IFT (15 mA for MOC3061, 10 mA for MOC3062, 5 mA for MOC3063) and absolute max IF (60 mA). This is static dv/dt. See Figure 7 for test circuit. Commutating dv/dt is a function of the load–driving thyristor(s) only.

TYPICAL CHARACTERISTICS TA = 25°C
1.5 +800 ITM , ON–STATE CURRENT (mA) +600 +400 +200 0 –200 –400 –600 –800 –4 –3 –2 –1 0 1 2 3 VTM, ON–STATE VOLTAGE (VOLTS) 4 5 OUTPUT PULSE WIDTH – 80 s IF = 30 mA f = 60 Hz TA = 25°C 1.4 1.3 V INH, NORMALIZED 1.2 1.1 1 0.9 0.8 0.7 0.6 0.5 –40 NORMALIZED TO TA = 25°C

–20

0 20 40 60 TA, AMBIENT TEMPERATURE (°C)

80

100

Figure 1. On–State Characteristics

Figure 2. Inhibit Voltage versus Temperature

MOC3061, MOC3062, MOC3063
500 I DRM1, PEAK BLOCKING CURRENT (nA) IF = 0 IDRM2, NORMALIZED 1.5 1.4 200 100 50 1.3 1.2 1.1 1 0.9 0.8 0.7 0.6 5 –40 –20 0 20 40 60 80 100 TA, AMBIENT TEMPERATURE (°C) –40 –20 0 20 40 60 80 100 TA, AMBIENT TEMPERATURE (°C) IF = RATED IFT

20 10

Figure 3. Leakage with LED Off versus Temperature
25 20

Figure 4. IDRM2, Leakage in Inhibit State versus Temperature

IFT, NORMALIZED LED TRIGGER CURRENT

1.5 1.4 IFT, NORMALIZED 1.3 1.2 1.1 1 0.9 0.8 0.7

NORMALIZED TO TA = 25°C

NORMALIZED TO: PWin 100 s

q

15

10

5 0

–40

–20

0 20 40 60 TA, AMBIENT TEMPERATURE (°C)

80

100

1

2

5 10 20 PWin, LED TRIGGER PULSE WIDTH (s)

50

100

Figure 5. Trigger Current versus Temperature

Figure 6. LED Current Required to Trigger versus LED Pulse Width

+400 Vdc

RTEST

R = 10 k

PULSE INPUT

CTEST MERCURY WETTED RELAY X100 SCOPE PROBE

D.U.T.

1. The mercury wetted relay provides a high speed repeated pulse to the D.U.T. 2. 100x scope probes are used, to allow high speeds and voltages. 3. The worst–case condition for static dv/dt is established by triggering the D.U.T. with a normal LED input current, then removing the current. The variable RTEST allows the dv/dt to be gradually increased until the D.U.T. continues to trigger in response to the applied voltage pulse, even after the LED current has been removed. The dv/dt is then decreased until the D.U.T. stops triggering. tRC is measured at this point and recorded. Vmax = 400 V

APPLIED VOLTAGE WAVEFORM

252 V dv dt
tRC

0 VOLTS

V + 0.63 RCmax + 378 RC
t t

Figure 7. Static dv/dt Test Circuit

MOC3061, MOC3062, MOC3063

VCC

Rin

1

6

360

HOT 39 240 Vac 0.01 LOAD NEUTRAL

2 MOC3061–63 5 3 4 360

Typical circuit for use when hot line switching is required. In this circuit the "hot" side of the line is switched and the load connected to the cold or neutral side. The load may be connected to either the neutral or hot line. Rin is calculated so that IF is equal to the rated IFT of the part, 15 mA for the MOC3061, 10 mA for the MOC3062, and 5 mA for the MOC3063. The 39 ohm resistor and 0.01 F capacitor are for snubbing of the triac and may or may not be necessary depending upon the particular triac and load used.

Figure 8. Hot–Line Switching Application Circuit

240 Vac R1 1 Rin 2 3 MOC3061–63 6 5 4 360 SCR SCR NOTE: This optoisolator should not be used to drive a load directly. It is intended to be a trigger device only. D2 R2 LOAD D1

VCC

Suggested method of firing two, back–to–back SCR's, with a Motorola triac driver. Diodes can be 1N4001; resistors, R1 and R2, are optional 330 ohms.

Figure 9. Inverse–Parallel SCR Driver Circuit

MOC3061, MOC3062, MOC3063
PACKAGE DIMENSIONS

–A–
6 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. DIM A B C D E F G J K L M N INCHES MIN MAX 0.320 0.350 0.240 0.260 0.115 0.200 0.016 0.020 0.040 0.070 0.010 0.014 0.100 BSC 0.008 0.012 0.100 0.150 0.300 BSC 0_ 15 _ 0.015 0.100 STYLE 6: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 8.13 8.89 6.10 6.60 2.93 5.08 0.41 0.50 1.02 1.77 0.25 0.36 2.54 BSC 0.21 0.30 2.54 3.81 7.62 BSC 0_ 15 _ 0.38 2.54

–B–
1 3

F 4 PL

N

C

L

–T–
SEATING PLANE

K G J 6 PL 0.13 (0.005) T A
M M

E 6 PL D 6 PL 0.13 (0.005)

M
M

T B

M

A

M

B

M

ANODE CATHODE NC MAIN TERMINAL SUBSTRATE MAIN TERMINAL

THRU HOLE

–A–
6 1 4

–B–
3

S

NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 0.320 0.350 0.240 0.260 0.115 0.200 0.016 0.020 0.040 0.070 0.010 0.014 0.100 BSC 0.020 0.025 0.008 0.012 0.006 0.035 0.320 BSC 0.332 0.390 MILLIMETERS MIN MAX 8.13 8.89 6.10 6.60 2.93 5.08 0.41 0.50 1.02 1.77 0.25 0.36 2.54 BSC 0.51 0.63 0.20 0.30 0.16 0.88 8.13 BSC 8.43 9.90

F 4 PL

H C

L

–T– G E 6 PL D 6 PL 0.13 (0.005)
M

J K 6 PL 0.13 (0.005) T A
M M

SEATING PLANE

T B

M

A

M

B

M

DIM A B C D E F G H J K L S

SURFACE MOUNT

MOC3061, MOC3062, MOC3063

–A–
6 4

–B–
1 3

NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. DIM A B C D E F G J K L N INCHES MIN MAX 0.320 0.350 0.240 0.260 0.115 0.200 0.016 0.020 0.040 0.070 0.010 0.014 0.100 BSC 0.008 0.012 0.100 0.150 0.400 0.425 0.015 0.040 MILLIMETERS MIN MAX 8.13 8.89 6.10 6.60 2.93 5.08 0.41 0.50 1.02 1.77 0.25 0.36 2.54 BSC 0.21 0.30 2.54 3.81 10.16 10.80 0.38 1.02

F 4 PL

N C

L

–T–
SEATING PLANE

G D 6 PL

K 0.13 (0.005)
M

J T A
M

E 6 PL

B

M

0.4" LEAD SPACING

DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.

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2000 Fairchild Semiconductor Corporation


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